Translated title of the contribution | : Fabrication process for vertical dicing-free light-emitting diodes with metal substrate |
Tsai, C.-L. (Inventor),
Lin, R.-M. (Inventor), WU, M.-Q. (Inventor), DONG, M.-H. (Inventor), GUO, Y.-J. (Inventor), CHOU, Y.-L. (Inventor) & LI, J.-C. (Inventor),
21 12 2014, IPC No. H01L 33/00(2010.01), Patent No. I466318
Research output: Patent