Projects per year
Personal profile
Courses
Electronic Packaging
Machine Workshop
Seminar(III)
Special Topics in Electronic/Optoelectronic Packaging
Machine Workshop
Mechanics of Composite Material
Statics
Machine Workshop
Seminar(III)
Special Topics in Electronic/Optoelectronic Packaging
Machine Workshop
Mechanics of Composite Material
Statics
Education
Ph.D., University of Virginia,USA
Keywords
- Adhesive bondingand Mechanics of composite materials
- Electronic/optoelectronic packaging
- Photomechanics
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Dive into the research topics where Ming-Yi Tsai is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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To Develop Low-Temperature Solder, Low-Cte Substrates, and Characterization of Material Interfacial Strength for Enhancing Reliability of Large Heterogeneous Integration Ic Packages (II)
Tsai, M.-Y. (PI)
01/08/24 → 31/07/25
Project: National Science and Technology Council › National Science and Technology Council Academic Grants
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To Develop Low-Temperature Solder, Low-Cte Substrates, and Characterization of Material Interfacial Strength for Enhancing Reliability of Large Heterogeneous Integration Ic Packages (Ii)
Tsai, M.-Y. (PI)
01/08/23 → 31/07/24
Project: National Science and Technology Council › National Science and Technology Council Academic Grants
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To Develop Low-Temperature Solder, Low-Cte Substrates, and Characterization of Material Interfacial Strength for Enhancing Reliability of Large Heterogeneous Integration Ic Packages
Tsai, M.-Y. (PI)
01/08/22 → 31/07/23
Project: National Science and Technology Council › National Science and Technology Council Academic Grants
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Developments of Fundamental Theories and Experimental Methods for Characterizing Ic Package Warpage and Die Strength in Heterogeneous Integration Applications
Tsai, M.-Y. (PI)
01/08/21 → 31/07/22
Project: National Science and Technology Council › National Science and Technology Council Academic Grants
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Developments of Fundamental Theories and Experimental Methods for Characterizing Ic Package Warpage and Die Strength in Heterogeneous Integration Applications
Tsai, M.-Y. (PI)
01/08/20 → 31/07/21
Project: National Science and Technology Council › National Science and Technology Council Academic Grants
Research output
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Biaxial bending strength of thin silicon dies in the ring-on-ring test by considering geometric nonlinearity and material anisotropy
Tsai, M. Y., Kuo, T. C., Hsieh, P. J. & Huang, P. S., 02 2025, In: Materials Science in Semiconductor Processing. 186, 109068.Research output: Contribution to journal › Journal Article › peer-review
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Correction Factors to Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test Due to Contact Nonlinearity Effect
Hsieh, P. J., Kuo, T. C. & Tsai, M. Y., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 165-166 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges
Wang, Y. W., Tsai, M. Y. & Chou, Y. S., 01 09 2024, In: Journal of Electronic Packaging, Transactions of the ASME. 146, 3, 031001.Research output: Contribution to journal › Journal Article › peer-review
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出席「ICEP2024」報告
Tsai, M.-Y., 2024.Research output: Contribution to conference › International Conference Report
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應用於評估薄矽晶片雙軸彎曲強度的球對環測試法之相關修正係數
Tsai, M.-Y., 謝博任 & 郭子誠, 2024.Research output: Contribution to conference › Proceeding