Personal profile
Courses
Electronic Packaging
Seminar
Mechanics of Composite Material
Statics
Education
Keywords
- Adhesive bondingand Mechanics of composite materials
- Electronic/optoelectronic packaging
- Photomechanics
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure -
SDG 12 Responsible Consumption and Production
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Collaborations and top research areas from the last five years
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To Study and Develop Bending Tests of Evaluating Strength of Glass Substrates with Tgvs for Advanced Ic Packaging Applications( I )
Tsai, M.-Y. (PI)
01/08/25 → 31/07/26
Project: National Science and Technology Council › National Science and Technology Council Academic Grants
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To Develop Low-Temperature Solder, Low-Cte Substrates, and Characterization of Material Interfacial Strength for Enhancing Reliability of Large Heterogeneous Integration Ic Packages (II)
Tsai, M.-Y. (PI)
01/08/24 → 31/07/25
Project: National Science and Technology Council › National Science and Technology Council Academic Grants
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To Develop Low-Temperature Solder, Low-Cte Substrates, and Characterization of Material Interfacial Strength for Enhancing Reliability of Large Heterogeneous Integration Ic Packages (Ii)
Tsai, M.-Y. (PI)
01/08/23 → 31/07/24
Project: National Science and Technology Council › National Science and Technology Council Academic Grants
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To Develop Low-Temperature Solder, Low-Cte Substrates, and Characterization of Material Interfacial Strength for Enhancing Reliability of Large Heterogeneous Integration Ic Packages
Tsai, M.-Y. (PI)
01/08/22 → 31/07/23
Project: National Science and Technology Council › National Science and Technology Council Academic Grants
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Developments of Fundamental Theories and Experimental Methods for Characterizing Ic Package Warpage and Die Strength in Heterogeneous Integration Applications
Tsai, M.-Y. (PI)
01/08/21 → 31/07/22
Project: National Science and Technology Council › National Science and Technology Council Academic Grants
Research output
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A theoretical solution for a novel load-on-elastic-foundation (LoEF) uniaxial bending test and its application to strength evaluation of thin silicon dies
Hsieh, P. J. & Tsai, M. Y., 15 06 2026, In: Materials Science in Semiconductor Processing. 208, 110556.Research output: Contribution to journal › Journal Article › peer-review
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Biaxial bending strength of thin silicon dies in the ring-on-ring test by considering geometric nonlinearity and material anisotropy
Tsai, M. Y., Kuo, T. C., Hsieh, P. J. & Huang, P. S., 02 2025, In: Materials Science in Semiconductor Processing. 186, 109068.Research output: Contribution to journal › Journal Article › peer-review
3 Scopus citations -
出席「Eurosime2025」報告
Tsai, M.-Y., 29 04 2025.Research output: Contribution to conference › International Conference Report
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Correction Factors to Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test Due to Contact Nonlinearity Effect
Hsieh, P. J., Kuo, T. C. & Tsai, M. Y., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 165-166 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Determination of Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test by Considering Contact Nonlinearity
Tsai, M.-Y., 2024.Research output: Contribution to conference › Proceeding
Activities
- 2 Participating in a conference, workshop, ...
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Eurosime2025
Tsai, M.-Y. (Participant)
06 04 2025 → 09 04 2025Activity: Participating in or organizing an event › Participating in a conference, workshop, ...
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ICEP2024
Tsai, M.-Y. (Participant)
17 04 2024 → 20 04 2024Activity: Participating in or organizing an event › Participating in a conference, workshop, ...