Project Details
Abstract
Taiwan had started planning fifth generation (5G) wireless and mobile internet service (Long Term
Evolution, LTE). Currently, 5G technology spectrum will be defined as 28GHz or 60GHz, which are much
higher than the spectrum 4G service used (2.6GHz) in the communications industry. However, 5G base
station system development is in infant stage owing to Taiwan had few key technologies for high power
base station industry. In addition, 5G communication system exists some serious demands on power
amplifier linearity, output power density, and power added efficiency. Moreover, China and Korea are
currently studying the 5G system and try to be the leading role in the Asian region. Therefore, although the
semiconductor technology is in excellent development in Taiwan but Taiwan lacks of system and module
integration ability for base station. For this project, first year, we will design and fabricate high frequency
and low leakage current InAlN/GaN microwave power HEMT on 6 inch SOI substrate to reduce substrate
loss tangent, And with low damage multi-cycle etching and nano-gate(LG=50nm) to improve
high-frequency characteristics. Besides, device reliability was designed to be improved by using implant
technology and micro-electromechanical technology on SOI substrate. During second year, cryogenic
chamber low-frequency noise model will be used for device buffer and surface traps identification together
with the trap activation energy extraction. In order to further evaluate InAlN/GaN reliability degradation
mechanism, the low-frequency noise spectra will be measured before and after high current or high voltage
stress. In addition, the modified Angelov model will also be adopted to establish the nonlinear larger signal
model for InAlN/GaN HEMT on SOI substrate together with the trap effect and thermal effect equation
descriptions. Finally, we will conduct low loss and high thermal dissipation AlN package technology to
realize high efficiency InAlN/GaN Doherty power amplifier for 5G base station applications. Overall, the
project can demonstrate novel InAlN/GaN microwave power HEMT on SOI substrate and its reliability
will also studied in advance. After the device evaluation is fully understood and realized, the 10 Watt
output power amplifier module will be also designed and demonstrated to enrich the system level ability
for Taiwan 5G wireless communication facility industry.
Project IDs
Project ID:PB10608-3660
External Project ID:MOST106-2221-E182-064
External Project ID:MOST106-2221-E182-064
| Status | Finished |
|---|---|
| Effective start/end date | 01/08/17 → 31/07/18 |
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