Development of a Resilience Assessment Table for Semiconductor Packaging and Testing Service Firm (I)

  • Gong, Dah-Chuan (PI)

Project: National Science and Technology CouncilNational Science and Technology Council Academic Grants

Project Details

Abstract

The numbers of natural disaster and damage have increased throughout the world. In 2011, some disasters, such as tsunami in Japan and flood in Thailand, heavily interrupted many firms. With these uncertainty in nature of disasters and destructive risk, firms are expected well-prepared or having strategy to face them. Firms can thus be more agile and resilient to restore causal damages immediately after the disasters happened. Therefore, “resilience” has recently replaced “risk management” to become one popular subject of the world, since having a stable operation system is a firm’s expectation. How to assess a firm’s capability away from crucial damage is indeed an issue of resilience. The semiconductor industry has been prosperously developed in Taiwan in the past three decades. With front-end technology and substantial experience, it is one of the top role players in the world. Especially, the packaging and testing service firms, such as ASE and SPIL, they are even the first place and the third place of the world, respectively, in terms of the market share. In this project, the semiconductor packaging and testing service firms are selected for research. The objective is to develop an assessment table of resilience for these firms. The concerning domain includes natural and man-made serious disasters. The project will start from literature reviews and apply the bibliometric analytical method to come out all possible resilient factors for measurement. Site visits and expertise interviews are implemented second and followed by the fault tree and event tree analyses on potential problems and influences once disasters are happened. Alternatives are generated to react to these problems and influences from associated departments. A conversion process is performed from those alternatives to a set of assessment factors. These factors are compared with previously obtained factors to ensure the consistency among them. Analytic Hierarchy Process is used to indicate factor weights and then to propose an assessment table. For validation, data from several firms will be applied. The obtained table will be amended as necessary. A recursive cycle can also be requested based on practical examinations or expert’s critical comments. In summary, this project mainly proposes the concept and approach to develop a resilience assessment table for semiconductor packaging and testing service firms. It provides the priority improvement advice to firms by scoring the resilience from firm’s feedback. Hence, firms would achieve the highest response of resilient effectiveness with limited resources.

Project IDs

Project ID:PB10608-2414
External Project ID:MOST106-2221-E182-040
StatusFinished
Effective start/end date01/08/1731/07/18

Keywords

  • Risk management
  • Resilience
  • IC packaging and testing service firm
  • Assessment table

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