Project Details
Abstract
The numbers of natural disaster and damage have increased throughout the world. In 2011, some
disasters, such as tsunami in Japan and flood in Thailand, heavily interrupted many firms. With these
uncertainty in nature of disasters and destructive risk, firms are expected well-prepared or having strategy to
face them. Firms can thus be more agile and resilient to restore causal damages immediately after the
disasters happened. Therefore, “resilience” has recently replaced “risk management” to become one popular
subject of the world, since having a stable operation system is a firm’s expectation. How to assess a firm’s
capability away from crucial damage is indeed an issue of resilience.
The semiconductor industry has been prosperously developed in Taiwan in the past three decades. With
front-end technology and substantial experience, it is one of the top role players in the world. Especially, the
packaging and testing service firms, such as ASE and SPIL, they are even the first place and the third place of
the world, respectively, in terms of the market share. In this project, the semiconductor packaging and testing
service firms are selected for research. The objective is to develop an assessment table of resilience for these
firms. The concerning domain includes natural and man-made serious disasters. The project will start from
literature reviews and apply the bibliometric analytical method to come out all possible resilient factors for
measurement. Site visits and expertise interviews are implemented second and followed by the fault tree and
event tree analyses on potential problems and influences once disasters are happened. Alternatives are
generated to react to these problems and influences from associated departments. A conversion process is
performed from those alternatives to a set of assessment factors. These factors are compared with previously
obtained factors to ensure the consistency among them. Analytic Hierarchy Process is used to indicate factor
weights and then to propose an assessment table. For validation, data from several firms will be applied. The
obtained table will be amended as necessary. A recursive cycle can also be requested based on practical
examinations or expert’s critical comments. In summary, this project mainly proposes the concept and
approach to develop a resilience assessment table for semiconductor packaging and testing service firms. It
provides the priority improvement advice to firms by scoring the resilience from firm’s feedback. Hence,
firms would achieve the highest response of resilient effectiveness with limited resources.
Project IDs
Project ID:PB10608-2414
External Project ID:MOST106-2221-E182-040
External Project ID:MOST106-2221-E182-040
Status | Finished |
---|---|
Effective start/end date | 01/08/17 → 31/07/18 |
Keywords
- Risk management
- Resilience
- IC packaging and testing service firm
- Assessment table
Fingerprint
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.