Project Details
Abstract
本計畫主要探討剪、衝(Shearing 、pressing)及 高壓水刀(Waterjet)切割基材(Prepreg)、銅箔基板( Copper foil plate)及多層板等由環氧樹脂(Epoxy),玻 璃纖維(Fiberglass)及/或銅箔等結合之複合材料( Composite material),其亦為製造多層印刷電路板( Multi-layerprinted-circuit-board; PCB)之材料.在機械 式剪、衝方面,乃以不同切割間隙(Clearness),切 割刀具角度(Tool angle)及模具組合來尋求最佳之 切割條件:高切割速度,高切割深度,減少切割邊 緣破損,最少量環氧樹脂粒逸出,減少玻璃纖維 拉出及防止多層板之層間脫離(Delamination);同時 、利用光學及掃描式電子顯微鏡觀察分析所切 割之材料斷面,探討其切斷模式之理論,以期改 善多層印刷電路板之切割能力.在高壓水刀切 割方面,亦研究分析其切割上述之多層印刷電 路板材料,並比較評估其應用於此復合材質切 割之可行性.
Project IDs
Project ID:PA8403-2109
External Project ID:NSC84-2212-E182-008
External Project ID:NSC84-2212-E182-008
| Status | Finished |
|---|---|
| Effective start/end date | 01/08/94 → 31/07/95 |
Keywords
- Prepreg
- Multi-layer printed circuit board
- Cutting clearness
- Tool angle
- Water jet
- Cutting mechanism
Fingerprint
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.