Developments of Fundamental Theories and Experimental Methods for Characterizing Ic Package Warpage and Die Strength in Heterogeneous Integration Applications

Tsai, Ming-Yi (PI)

Department of Mechanical Engineering

Project: National Science and Technology Council › National Science and Technology Council Academic Grants

Project IDs

Project ID:PB10807-12349
External Project ID:MOST108-2221-E182-045-MY3

Status	Finished
Effective start/end date	01/08/19 → 31/07/20

Keywords

Heterogeneous Integration Package
Thin Die Bending Strength
Thermal Warpage
Theoretical Analysis
Experimental Measurement
Thermal Stress Analysis

Access Project

https://www.grb.gov.tw/search/planDetail?id=13125869