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Developments of Fundamental Theories and Experimental Methods for Characterizing Ic Package Warpage and Die Strength in Heterogeneous Integration Applications

Project: National Science and Technology Council › National Science and Technology Council Academic Grants

Project Details

Project IDs

Project ID:PB10807-12349
External Project ID:MOST108-2221-E182-045-MY3
StatusFinished
Effective start/end date01/08/19 → 31/07/20

Keywords

  • Heterogeneous Integration Package
  • Thin Die Bending Strength
  • Thermal Warpage
  • Theoretical Analysis
  • Experimental Measurement
  • Thermal Stress Analysis

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