Project Details
Abstract
目前運算架構轉向分散,硬體系統架構也是趨向分散,需要發展三維積體電路。本計畫將釐清非晶化臨界值以下的離子植入摻雜經微波退火產生載子的機制,協助導入微波退火於後段低溫三維製程。
Project IDs
Project ID:PB11207-4311
External Project ID:NSTC112-2221-E182-066
External Project ID:NSTC112-2221-E182-066
Status | Finished |
---|---|
Effective start/end date | 01/08/23 → 31/07/24 |
Keywords
- defect
- carrier
- ion implantation
- microwave annealing
- Hall measurement
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