Investigation of Thermo-Mechanical Behaviors of Flip Chip BGA Packages during Fabrication Process and Thermal Cycling

Tsai, Ming-Yi (PI)

Department of Mechanical Engineering

Project: National Science and Technology Council › National Science and Technology Council Academic Grants

Project IDs

Project ID:PB9208-1532
External Project ID:NSC92-2212-E182-004

Status	Finished
Effective start/end date	01/08/03 → 31/07/04

Access Project

https://www.grb.gov.tw/search/planDetail?id=864060