Novel Graphenated Copper Interconnect Structure for Advanced Vlsi

ULSI interconnection is an integral part of Integrated Circuits. The quest for reliable interconnects in ULSI is always on the top priority as semiconductor technology is progressing with the ever shrinking interconnect line width. In fact, interconnect reliability is now the key bottleneck for the advanced integrated circuit technology. Recently, Graphene is proving to be a promising candidate to compete with the properties of Copper in terms of conductivity and reliability. Its application in the field of interconnects has been under investigation and can serve as future of ULSI interconnections. This project is intended to develop an Atomic-level Finite Element Model for a novel Metal-Graphene-Metal Sandwiched Graphenated Cu Interconnect system which will enable us to evaluate EM performance and determine EM lifetime using simulation. This is to prove that the presence of Graphene in turn can improve the electrical conductivity and Electromigration lifetime of interconnects. The simulation model will be used to predict the ‘real-time’ EM lifetime for the Graphenated Cu interconnect system. The required fabrication will be carried out and tester will be set up in order to verify the simulation model. Metal on Graphenated interconnect systems for NIST single level test structures with and without Graphene will be fabricated and characterized. They will verify the conduction and EM performance from the Atomic based Finite element model. This verification will be used as a benchmark to evaluate the accuracy of the model and the EM lifetime data for and M1-M2 test structure (without Graphene). Methods to deposit Cu by electroless methods without use of any other chemical will be explored which will pave a new way for standard damascene process.

Project ID:PB10708-1649
External Project ID:MOST107-2221-E182-040