Research and Development of a PCS Down Converter Fabrication on the Multi-Layer Alumina Substrate(II)

Lee, J. Yen (PI)
Chiang, Yi-Chyun (CoPI)
Kao, Hui-Ling (CoPI)
Wu, Yao-Hua (CoPI)

Project: National Science and Technology Council › National Science and Technology Council Academic Grants

Project IDs

Project ID:PA8504-2102
External Project ID:NSC85-2221-E182-001

Status	Finished
Effective start/end date	01/08/95 → 31/07/96

Keywords

Microwave integrated circuit
Multi-layer substrate
Low noise RF amplifier
Wireless personal communication system

Access Project

https://www.grb.gov.tw/search/planDetail?id=238352