Research and Development of a PCS RF Down Converter Fabricating on the Multi-Layer Alumina Substrate (Ⅲ)

Project: National Science and Technology Council › National Science and Technology Council Academic Grants

Project Details

Abstract

本計畫在於設計並開發一個製作在多層氧化鋁基板上的混合式微波積體電路(MIC)。本計畫分為電路設計、電路模擬、薄膜製作與半導體技術四個子計畫。這個電路包含低雜訊放大器、濾波器、混波器及振盪器。濾波器擬使用聲波濾波器及慢波濾波器；混波器與振波器之主動元件擬採用自製之加強型接面場效電晶體。本年度已完成加蓋導波管微帶之模擬，電路設計與模擬，Ta2O5薄膜電容器製作，集總電感製作與JFET初型之製作，詳細情形將在各子計畫中分別說明。

Project IDs

Project ID:PA8512-2415
External Project ID:NSC86-2221-E182-001
StatusFinished
Effective start/end date01/08/96 → 31/07/97

Keywords

  • Microwave integrated circuit
  • Multilayer substrate
  • Low noise RF amplifier

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