Shallow Trench Isolation Induced Two-Dimensional Mechanical Stress Effects on the Scaling of Deep Submicron Devices

Yang, Jun-Zhe (PI)

Department of Electronic Engineering

Project: National Science and Technology Council › National Science and Technology Council Academic Grants

Project IDs

Project ID:PB9108-3283
External Project ID:NSC91-2215-E182-003

Status	Finished
Effective start/end date	01/08/02 → 31/07/03

Access Project

https://www.grb.gov.tw/search/planDetail?id=784837