The Demonstration of Flexibility Filter and Balun on a Liquid Crystal Polymer Substrate Using Fully Inkjet-Printed Technology

Inkjet-printed technology is useful for substrate selection. The use of fully inkjet-printed technology on a liquid crystal polymer (LCP) substrate to produce high-frequency passive components has been taken important. The fully inkjet-printed technology including inkjet printing metal, dielectric and via. The advantages of inkjet printing technology on a LCP substrate is fast process, low cost, environmentally friendly, and is widely used for high frequency applications. The project uses LCP substrate due to its flexibility and low moisture absorption which comply with portable and wearable electronics. In the 1st year, inkjet printing via process and high frequency passive devices and filter are realized on a LCP bonding layer. In the 2nd year, the fully inkjet-printed technology is used silver for metal layer and SU-8 polymer for dielectric layer. Via is filled according to via process from the 1st year. The high frequency passive devices and balun using fully inkjet-printed technology are realized. In the following is our proposed plan for this 2 years project: 1. Inkjet printing via: Inkjet printing silver to via at LCP bonding layer to obtain blind and buried via and measured its electrical characteristics. 2. Multilayer testkey with via development: Using the inkjet printing process at LCP bonding layer to realized inductors, capacitors, and transformers. 3. Multilayer filter with via: Using the inkjet printing process at LCP bonding layer to realized multilayer cascade trisection filter for compact size. 4. Inkjet printing SU-8 : SU-8 process conditions including temperature, time, flatness and thickness and via filled. 5. SU-8 high frequency parameters extract: using ring resonator to extract dielectric constant and loass tangent. 6. Multilayer testkey and balun using fully inkjet-printed technology: Using fully inkjet printing process to realized inductors, capacitors, transformers, and broadside coupled balun.

Project ID:PB10408-5725
External Project ID:MOST104-2221-E182-006