The Demonstration of Miniature Filter on Multi-layer LCP Using Inkjet-Printed Technology

Inkjet printed technology is useful for substrate selection. Many reports have presented the research of inkjet printed technology due to its advantages of faster, low cost and environmental protection. The high frequency applications of inkjet printed technology are very wide. The RF circuit integration and package on LCP substrate using inkjet printed technology is very competitive. LCP substrate is roll-off-roll and can be stacked multi-layer. Combination of inkjet printed technology and multi-layer structure for printed passive components can achieve miniature. In this proposal, the miniature filter is realized by inkjet printed technology and multi-layer thermo-bonding technology on LCP substrate. The inkjet printed technology can be achieved the integrated circuit. In the following is our proposed plan for this 2 years project. 1. Inkjet printed technology and LCP surface disposed: using atmospheric-pressure plasma to dispose LCP substrate surface and inkjet printing Ag on LCP substrate. 2. LCP thermo-bonding technology: lamination LCP and thermoplastic adhesive material to realized multi-layer structure. 3. Multi-layer LCP testkey development: design and realize transmission line, capacitor, inductor and contact chain, etc, including alignment and via hole, for measured and model setup. 4. Multi-layer inkjet printed for resonator: using passive devices, inductor and capacitor, etc, to realize resonator. 5. Multi-layer inkjet printed for filter: using inkjet printed technology and multi-layer bonding to miniature filter and also develop circuit integration.

Project ID:PB10207-1801
External Project ID:NSC102-2221-E182-011