The Design Research and Chip Implementation of Integrated Crack/Defect Detectors with New Magnetic Sensors of High Sensitivity

Project: National Science and Technology CouncilNational Science and Technology Council Academic Grants

Project Details

Abstract

As the complexity of integrated circuits increases, the demanding for sensor applications is more and more urgent. Among them, the magnetic field sensing application is an important technology. Since few magnetic devices and circuits are now available the development is very urgent for practical applications. Therefore, this project is dedicated to new magnetic sensor devices and application circuits.In this project, the key research targets are(1) integrated crack circuits with ability to detect crack/defect of 1um dimension;(2) new and symmetrical sensor devices (BiNMOS and NMOS) with high sensitivity for low B-field sensing;(3) readout circuits by new magnetic sensors with temperature compensation, CDS and spinning current technique; and(4) sensor devices models and investigation on sensor geometrical effect on sensor current.Many design techniques will be proposed in this project to improve the circuit performance of the sensors and readout and application circuits. As compared to the most advanced prior art, the research target is very innovative and challenging. Development results of this project shall be very innovative. Besides, this project shall be very helpful to both the academic research and technical progress of microelectronics community as well as student training on analog/mixed-signal sensor and interface applications circuit design.

Project IDs

Project ID:PB10708-2284
External Project ID:MOST107-2221-E182-067
StatusFinished
Effective start/end date01/08/1831/07/19

Keywords

  • magnetic sensor
  • CMOS
  • integrated circuit
  • readout circuit
  • spinning current
  • crack/defect detection

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