The Study on Ultrasonic Thermosetting of EPOXY between Prepleg and Copper-Film in PCB

Sun, Ming-Tsung (PI)

Department of Mechanical Engineering

Project: National Science and Technology Council › National Science and Technology Council Academic Grants

Project IDs

Project ID:PA8512-2659
External Project ID:NSC86-2212-E182-006

Status	Finished
Effective start/end date	01/08/96 → 31/07/97

Keywords

Ultrasonic welding
Printed circuit board
Epoxy
Copper film
Glass fiber
Peeling strength

Access Project

https://www.grb.gov.tw/search/planDetail?id=280070