Thermal Deformation Measurements of Electronic Packages Using Laser Interferometry Systems

Tsai, Ming-Yi (PI)

Department of Mechanical Engineering

Project: National Science and Technology Council › National Science and Technology Council Academic Grants

Project IDs

Project ID:PB9009-0067
External Project ID:NSC90-2212-E182-004

Status	Finished
Effective start/end date	01/08/01 → 31/07/02

Keywords

Thermal deformation analysis
Electronic package
Laser interferometer

Access Project

https://www.grb.gov.tw/search/planDetail?id=662766