To Develop Low-Temperature Solder, Low-Cte Substrates, and Characterization of Material Interfacial Strength for Enhancing Reliability of Large Heterogeneous Integration Ic Packages (Ii)

Project: National Science and Technology CouncilNational Science and Technology Council Academic Grants

Project Details

Abstract

此三年期計劃為擬提出評估低熱膨脹係數基板與其構裝體熱翹曲行為與熱應力;用錫球剪力測試方法評估低溫銲錫;以及開發材料介面強度測試法,以提升異質整合構裝之2.5D與3D IC先進構裝技術。執行過程中,將與國內之半導體製造構裝與材料公司進行合作,專注於研究低溫無鉛銲接、低熱膨脹係數複合基板、材料介面強度以及可靠度相關議題。將與材料領域及構裝領域相關研發人員有緊密的互動與合作,攜手業界共同解決大型異質整合先進構裝技術所面臨之問題,協助產品開發與發表學術研究論文。透過該計畫之執行,以強化台灣半導體科技之人才培育與科技發展,使台灣之半導體科技與產業持續維持高度競爭力,便於在世界舞台上佔舉足輕重之地位。

Project IDs

Project ID:PB11207-2832
External Project ID:NSTC112-2221-E182-058-MY2
StatusActive
Effective start/end date01/08/2331/07/24

Keywords

  • Large-size heterogeneous integrated package
  • Low-CTE substrate
  • Low-temperature solder
  • Material interface strength
  • Experimental measurements
  • Thermal stress and deformation analyses

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