To Develop Low-Temperature Solder, Low-Cte Substrates, and Characterization of Material Interfacial Strength for Enhancing Reliability of Large Heterogeneous Integration Ic Packages

Tsai, Ming-Yi (PI)

Department of Mechanical Engineering

Project: National Science and Technology Council › National Science and Technology Council Academic Grants

Abstract

此三年期之研究計劃執行過程中，將與國內之半導體製造構裝與材料公司進行合作，專注於研究低溫無鉛銲接、低熱膨脹係數複合基板、材料介面強度以及可靠度相關議題，將與材料領域及構裝領域相關研發人員有緊密的互動與合作，攜手業界共同解決大型異質整合先進構裝技術所面臨之問題，協助產品開發與發表學術研究論文。透過該計畫之執行，以強化台灣半導體科技之人才培育與科技發展，使台灣之半導體科技與產業持續維持高度競爭力，便於在世界舞台上佔舉足輕重之地位。

Project IDs

Project ID:PB11107-8490
External Project ID:MOST111-2221-E182-045

Status	Finished
Effective start/end date	01/08/22 → 31/07/23

Keywords

Large-size heterogeneous integrated package
Low-temperature solder
Low-CTE substrate
Material interface strength
Experimental measurements
Thermal stress and deformation analyses

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https://www.grb.gov.tw/search/planDetail?id=14511651

To Develop Low-Temperature Solder, Low-Cte Substrates, and Characterization of Material Interfacial Strength for Enhancing Reliability of Large Heterogeneous Integration Ic Packages

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Abstract

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Keywords

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