Warpage Control and Parametric Study of 2.5d Ic Packages during the Fabrication Process: Measurement, Theoretical and Numerical Analyses (II)

For 2.5D IC packaging, the thermal warpage and internal stresses in chips/TSV silicon interposer module and its package during the stacking process and subsequent reliability testing are very important. Studies in the literature not only ignored in the process-induced material residual strain, but theoretical analyses of warping behavior in its substrate modules and package are also lacking. This study will take into account the effect of material residual strains (which will be quantified from experiments) and further provide the detailed thermal deformation and stress analyses of its interposer module and package during stacking process and reliability testing by using theoretical, experimental and numerical analyses. The main goal of this project is two-fold: 1) To determine the effects of material properties and geometry on thermal deformations (warpage) and stresses of 2.5D IC package during the manufacturing process has been on going in the first year; and 2). To characterize the material residual strains of encapsulants and underfills and further investigate the effects of material properties, geometry and process parameters on thermal deformations (warpage) and stresses of the TSV silicon interposer module during the manufacturing process will be in the second year. The methodologies used includes experimental methods (Twyman-Green interferometry, shadow moire, and strain gage), a finite element numerical method and related theories (Timoshenko bi-material and Suhir theories). The test samples and process conditions will be supported by local semiconductor foundries and packaging houses. The project will eventually create a close collaboration with local semiconductor packaging houses and further help them tackle this hot issue in which the world-wide semiconductor companies and academia are currently very interesting. It is hopeful that such search collaboration will show a good example of a partnership between academia and industry.

Project ID:PB10708-1783
External Project ID:MOST107-2221-E182-065