Warpage Control and Parametric Study of 2.5d Ic Packages during the Fabrication Process: Measurement, Theoretical and Numerical Analyeses

In an application to 2.5D IC package, the thermal warpage and internal stresses in chips/TSV silicon interposer module and its package during the stacking process and subsequent reliability testing are very important. Studies in the literature not only ignored in the process of material residual strain, and theoretical analysis of warping behavior in substrate modules and its package is also lacking. This study will take into account the material residual strains (which will be quantified from experiments) and provide the detailed thermal deformation and stress analyses of interposer module and its package during stacking process and reliability testing using theoretical, experimental and numerical analyses. The main goal of this project is two-fold: 1) in the first year to characterize the material residual strains of encapsulants and underfills and further investigate the effects of material properties, geometry and process parameters on thermal deformations (warpage) and stresses of the TSV silicon interposer module during the manufacturing process; and 2) further to determine he effects of material properties, geometry and process parameters on thermal deformations (warpage) and stresses of 2.5D IC package during the manufacturing process and subsequent reliability testing in the second year. The methodologies used includes experimental methods (Twyman-Green interferometry, shadow moiré, strain gage), a finite element numerical method and related theories (Timoshenko bi-material and Suhir theories). The test samples and process conditions will be supported by local semiconductor foundries and packaging houses. The project will eventually create a close collaboration with local semiconductor packaging houses and further help them tackle this hot issue in which the world-wide semiconductor companies and academia are currently very interesting. It is hopeful that this search collaboration will show a good example of a partnership between academia and industry.

Project ID:PB10607-1028
External Project ID:MOST106-2221-E182-030