Abstract
The invention relates a heat dissipation structure with graphene and copper, and a formation method thereof, comprising a copper foil layer provided, then forming a graphene layer on the copper foil layer surface, and forming an electroplating copper layer on the graphene layer surface, and eventually forming an electroplating copper layer-graphene layer-copper foil layer sandwich heat dissipation structure.
| Translated title of the contribution | A HEAT DISSIPATION STRUCTURE WITH GRAPHENE AND COPPER, AND A FORMATION METHOD THEREOF |
|---|---|
| Original language | Chinese (Traditional) |
| IPC | C23C 28/00(2006.01); B32B 9/00(2006.01); B32B 15/04(2006.01); B32B 15/20(2006.01); H01L 23/373(2006.01); H05K 7/20(2006.01) |
| State | Published - 16 01 2024 |
Bibliographical note
公開公告號: 2.02403101E8Announcement ID: 2.02403101E8
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