三維晶片堆疊記憶體模組之散熱行為研究

Translated title of the contribution: Thermal Analyses of DRAM Modules with 3D Chip-Stacked Packages
  • 蕭楨楠

Research output: Types of Thesis › Master's thesis

Translated title of the contributionThermal Analyses of DRAM Modules with 3D Chip-Stacked Packages
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2011
Externally publishedYes

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