具有突波保護性基板之穿孔發光二極體覆晶結構

A light-emitting diode (LED) flip-chip structure is disclosed, comprising a first substrate, solders and an LED die. The LED die is connected onto the first substrate through the solders and comprises a second substrate and an LED structure. The second substrate has a plurality of holes extending downward from a surface thereof farther from the LED structure and at least one of the pluralities of holes extending to an active layer of the LED structure. At an embodiment, the at least one hole extends through the LED structure. With the LED flip-chip structure, not only light extraction efficiency may be promoted but also good heat sinking is achieved. Although the hole extends through the LED structure, electrical characteristics of the LED structure is still maintained.