具有突波保護性基板之穿孔發光二極體覆晶結構

Translated title of the contribution: Light-emitting diode (LED) flip-chip structure

Liann-Be Chang (Inventor), MEI-JIAO HUANG (Inventor), YUAN-XIAO ZHANG (Inventor)

Research output: Patent

Abstract

A light-emitting diode (LED) flip-chip structure is disclosed, comprising a first substrate, solders and a LED die. The LED die is connected onto the first substrate through the solders and comprises a second substrate and a LED structure. The second substrate has a plurality of holes extending downward from a surface thereof farer from the LED structure and at least one of the plurality of holes extending to an active layer of the LED structure. At an embodiment, the at least one hole extends through the LED structure. With the LED flip-chip structure, not only light extraction efficiency may be promoted but also good heat sinking is achieved. Although the hole extends through the LED structure electrical characteristics of the LED structure is still maintained.
Translated title of the contributionLight-emitting diode (LED) flip-chip structure
Original languageChinese (Traditional)
Patent numberI258232
IPCH01L 33/62(2010.01)
StatePublished - 11 07 2006

Bibliographical note

公開公告號: I258232
Announcement ID: I258232

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