出席「2017 IEEE Electrical Design of Advanced Packaging & System Symposium (EPAPS 2017)」報告

Research output: Contribution to conference › International Conference Report

Original language	Chinese (Traditional)
State	Published - 2017
Event	2017 IEEE Electrical Design of Advanced Packaging & System Symposium (EPAPS 2017) - Hangzhou, China Duration: 14 12 2017 → 16 12 2017

Conference	2017 IEEE Electrical Design of Advanced Packaging & System Symposium (EPAPS 2017)
Period	14/12/17 → 16/12/17

Cite this

@conference{da2426ec56e044909529fac180bb6ac3,

title = "出席「2017 IEEE Electrical Design of Advanced Packaging \& System Symposium (EPAPS 2017)」報告",

author = "Cher-Ming Tan",

year = "2017",

language = "繁體中文",

note = "2017 IEEE Electrical Design of Advanced Packaging \& System Symposium (EPAPS 2017) ; Conference date: 14-12-2017 Through 16-12-2017",

}