出席「The 21st International Conference on Electronics Materials and Packaging (EMAP2019)」報告

Research output: Contribution to conference › International Conference Report

Original language	Chinese (Traditional)
State	Published - 2019
Event	The 21st International Conference on Electronics Materials and Packaging (EMAP2019) - Busan, Korea(South) Duration: 13 11 2019 → 15 11 2019

Conference	The 21st International Conference on Electronics Materials and Packaging (EMAP2019)
Period	13/11/19 → 15/11/19

Cite this

@conference{ce8e03e3e51048f0abcc92787d9e7a3b,

title = "出席「The 21st International Conference on Electronics Materials and Packaging (EMAP2019)」報告",

author = "Ming-Yi Tsai",

year = "2019",

language = "繁體中文",

note = "The 21st International Conference on Electronics Materials and Packaging (EMAP2019) ; Conference date: 13-11-2019 Through 15-11-2019",

}