利用應變規量測印刷電路板在迴銲製程中之熱翹曲變形：方法與驗證

Translated title of the contribution: Thermal Deformation Measurements of PCB during Reflow Process by Using Strain Gage

林奕翔

Research output: Types of Thesis › Master's thesis

Translated title of the contributionThermal Deformation Measurements of PCB during Reflow Process by Using Strain Gage
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2010
Externally publishedYes

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