| Translated title of the contribution | Evaluation of Suhir's Theory Applied to Thermal Warpages of Flip-Chip Package and Wafer Bonding Substrate by Experiment and Simulation |
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| Original language | Chinese (Traditional) |
| Supervisors/Advisors |
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| State | Published - 2018 |
| Externally published | Yes |
利用電腦模擬與實驗評估Suhir理論應用於覆晶構裝體與晶圓黏著基板之熱翹曲變形之有效性
王昱文
Research output: Types of Thesis › Master's thesis