利用電腦模擬與實驗評估Suhir理論應用於覆晶構裝體與晶圓黏著基板之熱翹曲變形之有效性

Translated title of the contribution: Evaluation of Suhir's Theory Applied to Thermal Warpages of Flip-Chip Package and Wafer Bonding Substrate by Experiment and Simulation
  • 王昱文

Research output: Types of Thesis › Master's thesis

Translated title of the contributionEvaluation of Suhir's Theory Applied to Thermal Warpages of Flip-Chip Package and Wafer Bonding Substrate by Experiment and Simulation
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2018
Externally publishedYes

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