利用音洩法評估含銅矽穿孔矽晶片材料強度測試

Translated title of the contribution: Evaluation of Strength Tests of Cu TSV Chips Using Acoustic Emission Method
  • 呂峰銓

Research output: Types of Thesis › Master's thesis

Translated title of the contributionEvaluation of Strength Tests of Cu TSV Chips Using Acoustic Emission Method
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2015
Externally publishedYes

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