半導體封裝銲線製程金鋁介金屬化合物及可靠度工程之研究

Translated title of the contribution: A Study of the Au-Al Intermetallic Compound and Reliability of Semiconductor Assembly Wire Bond Process

宋雲志

Research output: Types of Thesis › Master's thesis

Translated title of the contributionA Study of the Au-Al Intermetallic Compound and Reliability of Semiconductor Assembly Wire Bond Process
Original languageChinese (Traditional)
Supervisors/Advisors
  • Chen, Wei-Chih, Supervisor
StatePublished - 2022
Externally publishedYes

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