反脈衝電鍍的操作參數對盲孔及通孔的填孔電鍍層性能之影響

Translated title of the contribution: The Effect of Pulse-Reverse Plating Operation Parameters on The Electro-Plating Performance of The Blind Micro Via and Through Hole Filling

林文彬

Research output: Types of ThesisMaster's thesis

Translated title of the contributionThe Effect of Pulse-Reverse Plating Operation Parameters on The Electro-Plating Performance of The Blind Micro Via and Through Hole Filling
Original languageChinese (Traditional)
Supervisors/Advisors
  • Lu, Tsan-Sheng, Supervisor
StatePublished - 2009
Externally publishedYes

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