可連接多顆晶片及具有防靜電破壞之覆晶基板的製造方法及其裝置

Translated title of the contribution: Method of fabricating flip chip substrate connecting with multi chips and having anti electrostatic destruction property and the device thereof

Liann-Be Chang (Inventor), XIN-YI ZHANG (Inventor), GUO-LING JIANG (Inventor)

Research output: Patent

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Engineering

Physics

Material Science