堆疊晶片封裝體熱變形與熱應力之分析與量測

Translated title of the contribution: Thermal Induced Deformations and Stresses of Stacked Die Packages

黃紹庚

Research output: Types of Thesis › Master's thesis

Translated title of the contributionThermal Induced Deformations and Stresses of Stacked Die Packages
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2004
Externally publishedYes

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