填充底膠對覆晶封裝體熱變形之影響

Translated title of the contribution: The Underfill Effect on the Thermal Deformation and Stresses of Flip-Chip Packages

林易杰

Research output: Types of Thesis › Master's thesis

Translated title of the contributionThe Underfill Effect on the Thermal Deformation and Stresses of Flip-Chip Packages
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2004
Externally publishedYes

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