壓合式覆晶發光元件結構及其製作方法

Translated title of the contribution: Pressing type flip-chip light-emitting element structure and manufacturing method thereof

Liann-Be Chang (Inventor), HUO-WEN CHIEN (Inventor), KUN XU (Inventor), YUN-YUN ZHANG (Inventor), CHEN XU (Inventor)

Research output: Patent

Abstract

A pressing type flip-chip light-emitting element structure and manufacturing method thereof which comprises steps of: firstly forming a positive electrode and a negative electrode on an epitaxial layer, next depositing an insulation layer on parts of the positive electrode and the negative electrode, and respectively exposing a positive electrode via hole and a negative electrode via hole, forming a pressed metal layer on the insulation layer, the positive electrode via hole, and the negative electrode via hole so that the positive electrode and the negative electrode are on the same plane through the pressed metal layer. The pressed metal layer has a first pressed metal unit and a second pressed metal unit isolated to each other and electrically connected to the positive electrode and the negative electrode respectively, and finally, on a substrate, enabling the first metal layer and the second metal layer respectively corresponding to the first pressed metal unit and the second pressed metal unit to perform pressing and forming. Thereby, complete the pressed type flip-chip light-emitting structure.
Translated title of the contributionPressing type flip-chip light-emitting element structure and manufacturing method thereof
Original languageChinese (Traditional)
IPCH01L-033/06(2010.01);H01L-033/36(2010.01);H01L-033/64(2010.01)
StatePublished - 16 09 2013

Bibliographical note

公開公告號: 2.01338198E8
Announcement ID: 2.01338198E8

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