封裝堆疊之構裝體熱變形機制研究與量測分析

Translated title of the contribution: Investigation of Thermally-Induced Warpage of Package on Package

郭柏辰

Research output: Types of ThesisMaster's thesis

Translated title of the contributionInvestigation of Thermally-Induced Warpage of Package on Package
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2008
Externally publishedYes

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