應用於三維IC封裝中含銅矽穿孔晶片之強度

Translated title of the contribution: Strength of Cu-TSV Chips Used in 3DIC Packaging

趙翌辰

Research output: Types of Thesis › Master's thesis

Translated title of the contributionStrength of Cu-TSV Chips Used in 3DIC Packaging
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2014
Externally publishedYes

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