應用於強化熱循環下錫球可靠度之伺服器CPU背板之分析與設計

Translated title of the contribution: Evaluation and Design of Server CPU Back Plate to Enhance Solder Joint Reliability under Thermal Cycling

廖孟傑

Research output: Types of Thesis › Doctoral thesis

Translated title of the contributionEvaluation and Design of Server CPU Back Plate to Enhance Solder Joint Reliability under Thermal Cycling
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2022
Externally publishedYes

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