應用於電子／光電封裝體黏膠之機械性質與殘留應力分析

Translated title of the contribution: Mechanical Properties and Residual Stress Analysis of Adhesives for Electronic and Optoelectronic Packages

姜智耀

Research output: Types of Thesis › Master's thesis

Translated title of the contributionMechanical Properties and Residual Stress Analysis of Adhesives for Electronic and Optoelectronic Packages
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2005
Externally publishedYes

Access to Document

Cite this