應用於高功率LED封裝之氮化鋁銅穿孔基板的熱應力分析與可靠度測試

Translated title of the contribution: Thermal Stress Analysis and Reliability Test of Through AlN Via Substrate for High Power LED Application

林晉瑄

Research output: Types of Thesis › Master's thesis

Translated title of the contributionThermal Stress Analysis and Reliability Test of Through AlN Via Substrate for High Power LED Application
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2015
Externally publishedYes

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