晶圓級發光二極體之製作方法

A method of fabricating wafer level LED includes the following steps: providing a substrate, wherein the substrate has a plurality of LED chips; point-measuring the LED chips to classify the LED chip into a coating region and a non-coating region; adhering at least a shield sheet on the mask to shield the non-coating region in LED chip; using the mask to align in the non-coating region and starting spraying fluorescent powder; and separating the mask from the non-coating region so that the fluorescent powder is merely coated on coating region in the LED chip. By using such the fabricating method , the restriction of conventionally spraying the fluorescent powder on the whole wafer can be overcome, and white light LEDs satisfying different color temperature demands can be fabricated on a single wafer at the same time.