晶片間距對多晶片覆晶封裝體之熱翹曲影響:實驗與模擬

Translated title of the contribution: Gap Effect on Thermal Warpages of Chiplet Flip-Chip Packages: Experiment and Simulation
  • 周雅昕

Research output: Types of Thesis › Master's thesis

Translated title of the contributionGap Effect on Thermal Warpages of Chiplet Flip-Chip Packages: Experiment and Simulation
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2024
Externally publishedYes

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