Abstract
The present invention discloses a packaging structure of an organic LED and a method for manufacturing the same. It provides an organic light emitting layer, which comprises an anode layer, an organic light emitting layer, and a cathode, wherein a first transparent passivation layer is set on the cathode layer. and the first transparent passivation layer has light transmittance greater than 80%. In addition, the first transparent passivation layer has an amorphous or crystalline structure for isolating oxygen and moisture transmission. The translucent protecting layer has greater than 80% light transmittance, either crystal or non-crystal structure, and can block oxygen and moisture. Due to the first transparent passivation layer goes through a sputtering coating process under vacuum at room temperature, it can be applied to flexible printed circuit boards. Furthermore, a second transparent passivation layer is fabricated under a base substrate, which is under the organic light emitter layer. Alternatively, a resin layer is fabricated on the first transparent passivation layer or under the second transparent passivation layer as the multi-layer packaging structure.
Translated title of the contribution | Packaging structure of organic light-emitting diode and method for manufacturing the same |
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Original language | Chinese (Traditional) |
Patent number | I369012 |
IPC | H01L 51/50(2006.01) |
State | Published - 01 10 2009 |
Bibliographical note
公開公告號: I369012Announcement ID: I369012