模封材料在電子封裝製程所造成之熱變形與殘留應力分析

Translated title of the contribution: EMC-Induced Thermal Deformations and Residual Stresses in IC Packaging

王志棟

Research output: Types of Thesis › Master's thesis

Translated title of the contributionEMC-Induced Thermal Deformations and Residual Stresses in IC Packaging
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2002
Externally publishedYes

Access to Document

Cite this