| Translated title of the contribution | The effect of addition of thiourea and chloride ion on the electrochemical behavior and microstructures of copper deposit |
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| Original language | Chinese (Traditional) |
| Supervisors/Advisors |
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| State | Published - 2010 |
| Externally published | Yes |
添加硫尿與氯離子對電鍍銅之電化學特性及顯微結構之影響
陳智偉
Research output: Types of Thesis › Master's thesis