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無氰化合物鋅合金表面電沉積銅鍍層之水溶液組成及方法

  • Ching-An Huang (Inventor)
  • , SONG-YOU MA (Inventor)
  • , RUO-XUAN ZHANG (Inventor)

Research output: Patent

Abstract

The invention relates a composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound zinc alloy surface. Owing to zinc alloy with a reactive character of chemical reaction, the surface needs to be treated with corrosion resistance through the method of electrodeposition. Firstly, the surface of zinc alloy is electrodeposited with conductive copper layer in an alkaline cupric sulfate bath and then is done with a thickness treatment of copper layer in a merchant cupric sulfate bath, afterwards, is coated with a nickel layer or a chromium layer from merchant nickel or merchant chromium electrolyte resulting in the surface having wear resistance and brightness. A pretreatment is fairly simple. The pretreatment composition is without HF and CrO3 and the electrolyte is also without hypertoxic cyanide-free compound. Thus, effluent standards of water pollution effluent standards are easily met and the working safety for operators is enhanced. The invention is highly valuable in industrial application
Original languageChinese (Traditional)
Patent numberI333514
IPCC25D-003/38(2006.01);C25D-021/14(2006.01)
StatePublished - 21 11 2010

Bibliographical note

公開公告號: I333514
Announcement ID: I333514

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