無氰化合物鋅合金表面電 積銅鍍層之水溶液組成及方法

Translated title of the contribution: A composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound zinc alloy surface

Ching-An Huang (Inventor), SONG-YOU MA (Inventor), RUO-XUAN ZHANG (Inventor)

Research output: Patent

Abstract

The invention relates a composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound zinc alloy surface. Owing to zinc alloy with a reactive character of chemical reaction, the surface needs to be treated with corrosion resistance through the method of electrodeposition. Firstly, the surface of zinc alloy is electrodeposited with conductive copper layer in an alkaline cupric sulfate bath and then is done with a thickness treatment of copper layer in a merchant cupric sulfate bath, afterwards, is coated with a nickel layer or a chromium layer from merchant nickel or merchant chromium electrolyte resulting in the surface having wear resistance and brightness. A pretreatment is fairly simple. The pretreatment composition is without HF and CrO3 and the electrolyte is also without hypertoxic cyanide-free compound. Thus, effluent standards of water pollution effluent standards are easily met and the working safety for operators is enhanced. The invention is highly valuable in industrial application
Translated title of the contributionA composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound zinc alloy surface
Original languageChinese (Traditional)
IPCC25D-003/38(2006.01);C25D-021/14(2006.01)
StatePublished - 16 11 2006

Bibliographical note

公開公告號: 2.00639278E8
Announcement ID: 2.00639278E8

Fingerprint

Dive into the research topics of 'A composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound zinc alloy surface'. Together they form a unique fingerprint.

Cite this